Description
User application could potentially make RPC call to the fastrpc driver and the driver will allow the message to go through to the remote subsystem in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24
Severity: HIGH (7.8) Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Published: July 25, 2019
Modified: Aug. 24, 2020
Fixed packages
References to Advisories, Solutions, and Tools
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cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:mdm9150:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:qcs405:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qualcomm_215_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:qualcomm_215:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_439:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_429:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_632:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_636:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_665_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_665:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_675:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_712:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_710:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_670:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_730_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_730:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_850:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sd_855:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sda660:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sdm439:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sdx20:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
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cpe:2.3:h:qualcomm:sdx24:-:*:*:*:*:*:*:*